US 11,756,815 B2
Apparatus for and method of monitoring warpage of substrate, substrate treatment apparatus, and substrate-type sensor
Yong Jun Seo, Hwaseong-si (KR); Sang Hyun Son, Busan (KR); Sang Min Ha, Daegu (KR); and Dong Ok Ahn, Hwaseong-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Oct. 28, 2020, as Appl. No. 17/83,189.
Claims priority of application No. 10-2019-0137479 (KR), filed on Oct. 31, 2019.
Prior Publication US 2021/0134628 A1, May 6, 2021
Int. Cl. H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/324 (2006.01); G01P 15/02 (2013.01); G01C 19/00 (2013.01); H01L 23/498 (2006.01)
CPC H01L 21/67248 (2013.01) [G01C 19/00 (2013.01); G01P 15/02 (2013.01); H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 23/4985 (2013.01); H01L 23/562 (2013.01)] 19 Claims
OG exemplary drawing
1. A substrate warpage monitoring apparatus comprising:
a sensing unit that is removably disposed on a substrate and is configured to detect warpage information of the substrate during a time when a treatment process is performed on the substrate; and
a processor operatively coupled to the sensing unit and configured to generate warpage state information of the substrate on the basis of the warpage information detected by the sensing unit,
wherein the sensing unit comprises a plurality of sensing modules disposed at positions spaced apart from each other on the substrate and configured to detect the warpage information generated at the respective positions at which the sensing modules are disposed, and
wherein the processor collects the warpage information detected by each of the sensing modules to generate the warpage state information.