US 11,756,803 B2
Gas delivery system for high pressure processing chamber
Qiwei Liang, Fremont, CA (US); Srinivas D. Nemani, Sunnyvale, CA (US); Sean S. Kang, San Ramon, CA (US); Adib Khan, Santa Clara, CA (US); and Ellie Y. Yieh, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Micromaterials, LLC, Wilmington, DE (US)
Filed on Nov. 29, 2022, as Appl. No. 18/71,085.
Application 18/071,085 is a division of application No. 16/933,927, filed on Jul. 20, 2020, granted, now 11,527,421.
Application 16/933,927 is a continuation of application No. 16/182,612, filed on Nov. 7, 2018, granted, now 10,720,341, issued on Jul. 21, 2020.
Claims priority of provisional application 62/584,794, filed on Nov. 11, 2017.
Prior Publication US 2023/0093374 A1, Mar. 23, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/324 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01)
CPC H01L 21/67017 (2013.01) [C23C 16/4412 (2013.01); C23C 16/455 (2013.01); H01L 21/324 (2013.01); H01L 21/6719 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/67253 (2013.01); H01L 22/20 (2013.01); H01L 21/67167 (2013.01)] 20 Claims
OG exemplary drawing
1. A method of operating a high-pressure processing system, the method comprising:
bringing a first chamber and a second chamber to a first pressure that is less than one atmosphere;
while an isolation valve is closed, reducing the first chamber from the first pressure to a second pressure and reducing the second chamber from the first pressure to a third pressure;
pressurizing the first chamber to a fourth pressure that is above atmospheric pressure and less than 10 atmospheres with a gas delivery system;
pressurizing the first chamber to a fifth pressure that is above 10 atmospheres with the gas delivery system; and
processing a substrate while the first chamber is at the fifth pressure.