US 12,414,417 B2
Optoelectronic device with glass carrier and method of manufacture
Berthold Hahn, Hemau-Hohenschambach (DE); Matthias Goldbach, Pentling (DE); and Georg Bogner, Hainsacker/Lappersdorf (DE)
Assigned to ams-OSRAM International GmbH, Regensburg (DE)
Appl. No. 17/798,855
Filed by ams-OSRAM International GmbH, Regensburg (DE)
PCT Filed Feb. 9, 2021, PCT No. PCT/EP2021/053053
§ 371(c)(1), (2) Date Aug. 10, 2022,
PCT Pub. No. WO2021/160596, PCT Pub. Date Aug. 19, 2021.
Claims priority of application No. 10 2020 103 433.4 (DE), filed on Feb. 11, 2020.
Prior Publication US 2023/0102780 A1, Mar. 30, 2023
Int. Cl. H10H 20/85 (2025.01); H01L 25/075 (2006.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/856 (2025.01); H10H 20/858 (2025.01); H10H 20/01 (2025.01); H10H 20/80 (2025.01)
CPC H10H 20/855 (2025.01) [H01L 25/0753 (2013.01); H10H 20/8511 (2025.01); H10H 20/856 (2025.01); H10H 20/8582 (2025.01); H10H 20/0363 (2025.01); H10H 20/872 (2025.01); H10H 20/882 (2025.01)] 19 Claims
OG exemplary drawing
 
1. An optoelectronic device comprising:
a glass carrier,
at least one light-scattering layer applied to the glass carrier, and
at least one surface-emitting component in a chip size package with an emission surface and a surface facing away from the emission surface comprising a first and a second contact pad, wherein
the emission surface is arranged on the at least one light-scattering layer by way of an adhesive;
at least one contact line contacts the second contact pad of the at least one surface-emitting component and extends along a side surface of the at least one surface-emitting component adjacent to the second contact pad in a direction of the glass carrier; and
a light-shaping structure is arranged on a surface of the glass carrier facing away from the surface-emitting component.