US 12,414,415 B2
Surface-emitting device with a light emitting diode and a sealing member
Yoshihiro Kanai, Tokyo-to (JP); Atsuo Tsuzuki, Tokyo-to (JP); Marii Nishikawa, Tokyo-to (JP); Kosuke Saeki, Tokyo-to (JP); and Shunsuke Furuya, Tokyo-to (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Appl. No. 18/727,541
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo-to (JP)
PCT Filed Jan. 11, 2023, PCT No. PCT/JP2023/000407
§ 371(c)(1), (2) Date Jul. 9, 2024,
PCT Pub. No. WO2023/136256, PCT Pub. Date Jul. 20, 2023.
Claims priority of application No. 2022-003216 (JP), filed on Jan. 12, 2022.
Prior Publication US 2025/0081687 A1, Mar. 6, 2025
Int. Cl. H01L 33/56 (2010.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H10H 20/854 (2025.01)
CPC H10H 20/854 (2025.01) [G02F 1/133603 (2013.01); G02F 1/133606 (2013.01); H01L 25/0753 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A surface-emitting device comprising:
a light-emitting diode substrate including a supporting substrate, and a light-emitting diode element placed on one surface side of the supporting substrate; and
a sealing member placed on a light-emitting diode element side surface of the light-emitting diode substrate, and configured to seal the light-emitting diode element;
wherein the light-emitting diode element includes a transparent substrate including inorganic material, and a light-emitting layer formed on one surface of the transparent substrate;
the light-emitting diode element is a bare chip in which the transparent substrate is exposed on a surface thereof;
the sealing member is in contact with the transparent substrate on a side surface and a surface opposite side to a surface where the light-emitting layer is formed;
a haze value of the sealing member is 4% or more, and a thickness thereof is thicker than a thickness of the light-emitting diode element,
the sealing member includes polyethylene based resins or polypropylene based resins; and
the sealing member is in contact with 90% or more of the side surface of the transparent substrate.