US 12,414,412 B2
Light-emitting chip transfer system and light-emitting chip transfer method
Chun-Lung Hsiao, Chongqing (CN); and Chaowei Yin, Chongqing (CN)
Assigned to CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD, Chongqing (CN)
Filed by CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD., Chongqing (CN)
Filed on Oct. 21, 2022, as Appl. No. 17/971,151.
Application 17/971,151 is a continuation of application No. PCT/CN2021/114233, filed on Aug. 24, 2021.
Prior Publication US 2023/0065563 A1, Mar. 2, 2023
Int. Cl. H10H 20/85 (2025.01); H10H 20/01 (2025.01); H10H 20/825 (2025.01)
CPC H10H 20/8506 (2025.01) [H10H 20/018 (2025.01); H10H 20/825 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting chip transfer system, comprising:
a growth substrate aligning a light-emitting chip with a chip bonding area on a front surface of a circuit board, wherein the light-emitting chip is magnetic and is bonded to the growth substrate through a laser dissociation layer, and the light-emitting chip and the chip bonding area aligned with the light-emitting chip are separated by a gap;
a laser device configured to irradiate a laser to the laser dissociation layer, wherein the laser dissociation layer is dissociated under laser irradiation, to separate the light-emitting chip from the growth substrate; and
a magnetic field generating device disposed at one side away from the front surface of the circuit board and configured to generate a magnetic field in the gap, wherein the magnetic field is configured to attract the light-emitting chip separated from the growth substrate to fall onto the chip bonding area aligned with the light-emitting chip.