US 12,414,391 B2
Image sensor, camera device including the image sensor, electronic device including the camera device, and method of manufacturing the image sensor
Younggu Jin, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 11, 2022, as Appl. No. 17/741,983.
Claims priority of application No. 10-2021-0118262 (KR), filed on Sep. 6, 2021.
Prior Publication US 2023/0071106 A1, Mar. 9, 2023
Int. Cl. H10F 39/00 (2025.01); H10F 39/18 (2025.01)
CPC H10F 39/8023 (2025.01) [H10F 39/18 (2025.01); H10F 39/8037 (2025.01); H10F 39/8053 (2025.01); H10F 39/8063 (2025.01)] 19 Claims
OG exemplary drawing
 
1. An image sensor comprising:
a light sensing element in a substrate;
a plurality of transfer gates (TGs) spaced apart from each other in a horizontal direction substantially parallel to a surface of the substrate, each of the plurality of TGs extending through a portion of the substrate and contacting the light sensing element;
a floating diffusion (FD) region at a portion of the substrate adjacent to the plurality of TGs;
a first division pattern extending at least partially through the substrate in a vertical direction substantially perpendicular to the surface of the substrate, the first division pattern having a first closed shape in a plan view;
a second division pattern connected to the first division pattern and extending from the first closed shape toward an outside of the first closed shape in a horizontal direction to form a second closed shape adjacent to the first closed shape in the plan view; and
a third division pattern connected to the first division pattern and extending from the first closed shape toward a center of the first closed shape,
wherein the FD region is between the plurality of TGs in a plan view.