| CPC H10B 51/00 (2023.02) [C23C 16/45536 (2013.01); H10D 1/692 (2025.01); H10D 30/6755 (2025.01); H10D 86/421 (2025.01); H10D 86/60 (2025.01)] | 20 Claims |

|
7. A method for fabricating a ferroelectric device, wherein the method comprises:
forming a ferroelectric device layer structure comprising:
a first electrode;
a second electrode;
a ferroelectric layer of hafnium zirconate (HZO); and
an oxide layer of Nb2O5 or Ta2O5 arranged on the ferroelectric layer,
wherein the ferroelectric layer and the oxide layer are arranged between the first electrode and the second electrode; and
annealing the layers of the ferroelectric device layer structure at a temperature in a range of 350° C.-750° C. if the oxide layer is made of Nb2O5 and in a range of 350° C.-900° C. if the oxide layer is made of Ta2O5.
|