| CPC H05K 7/20481 (2013.01) [B23P 15/26 (2013.01); B32B 9/007 (2013.01); B32B 9/041 (2013.01); B32B 15/20 (2013.01); C25D 5/54 (2013.01); F28F 3/00 (2013.01); F28F 21/02 (2013.01); F28F 21/085 (2013.01); B32B 2250/40 (2013.01); B32B 2307/302 (2013.01); C25B 11/043 (2021.01); C25D 3/38 (2013.01); F28F 2255/00 (2013.01)] | 3 Claims |

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1. A method for forming a heat management structure with graphene and copper, comprising:
providing a first electrochemical system, the first electrochemical system comprising a first potentiostat connected to a first cathode provided with a graphite rod, a first anode provided with a graphite rod, and a saturated calomel electrode as a first reference electrode, the first cathode, the first anode and the reference electrode being immersed in an electrolyte solution of potassium hydroxide;
applying a potential to the first anode to perform an electrochemical water decomposition reaction, wherein a graphene of said graphite rod undergoes a delamination reaction;
performing a centrifuge process for said electrolyte solution of potassium hydroxide, wherein a deionized water is used for washing to obtain washed graphene;
dispersing the washed graphene in alcohol to obtain a graphene dispersion solution;
spraying said graphene dispersion solution on a copper foil surface, and drying the graphene dispersion on the copper foil surface to form a a double-layer structure comprised of a graphene layer and a copper foil layer;
providing a second electrochemical system, the second electrochemical system comprising said double-layer structure as a second cathode, a platinum as a second anode, and a saturated calomel electrode as a second reference electrode, the second cathode, the second anode and the second reference electrode being immersed in a copper sulfate solution, an electroplating copper layer being deposited by electrodeposition on said double-layer structure; and
washing and drying said double-layer structure to obtain a three-layered structure comprising said electroplating copper layer, said graphene layer and said copper foil as a sandwich-style heat management structure.
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