US 12,414,269 B2
Interleaved heterogeneous heat pipes with different Qmax
Gaurav Patankar, Chandler, AZ (US); Ruander Cardenas, Portland, OR (US); Mark MacDonald, Beaverton, OR (US); and Akhilesh P. Rallabandi, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Nov. 5, 2020, as Appl. No. 17/090,624.
Prior Publication US 2021/0059073 A1, Feb. 25, 2021
Int. Cl. H05K 7/20 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); G06F 1/20 (2006.01); H01L 23/427 (2006.01)
CPC H05K 7/20336 (2013.01) [F28D 15/0275 (2013.01); F28D 15/04 (2013.01); H01L 23/427 (2013.01); G06F 1/20 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A computing device comprising:
a processor;
a heat sink;
a plurality of first heat pipes, individual of the plurality of first heat pipes thermally coupled to the processor at a first end of the individual first heat pipe and thermally coupled to the heat sink at a second end of the individual first heat pipe;
a plurality of second heat pipes, individual of the plurality of second heat pipes thermally coupled to the processor at a first end of the individual second heat pipe and thermally coupled to the heat sink at a second end of the individual second heat pipe; and
a plurality of third heat pipes, individual of the plurality of third heat pipes thermally coupled to the processor at a first end of the individual third heat pipe and thermally coupled to the heat sink at a second end of the individual third heat pipe;
wherein:
individual of the plurality of first heat pipes have a first thermal resistance and a first Qmax, individual of the plurality of second heat pipes have a second thermal resistance and a second Qmax, the first thermal resistance lower than the second thermal resistance, and the first Qmax lower than the second Qmax;
the plurality of first heat pipes is interleaved with the plurality of second heat pipes, wherein no first heat pipe is positioned adjacent to another first heat pipe and no second pipe is positioned adjacent to another second heat pipe;
individual of the plurality of third heat pipes have a third thermal resistance different from the first thermal resistance and the second thermal resistance and a third Qmax different from the first Qmax and the second Qmax; and
the plurality of third heat pipes is interleaved with the plurality of first heat pipes and the plurality of second heat pipes.