US 12,414,266 B2
Cooling apparatus and electronic device
Chao Wang, Dongguan (CN); and Hitoshi Sakamoto, Yokohama (JP)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Apr. 28, 2023, as Appl. No. 18/308,733.
Application 18/308,733 is a continuation of application No. PCT/CN2021/123054, filed on Oct. 11, 2021.
Claims priority of application No. 202011197002.6 (CN), filed on Oct. 31, 2020.
Prior Publication US 2023/0269906 A1, Aug. 24, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 1/0203 (2013.01); H05K 2201/064 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling apparatus comprising:
a jet plate, and
a carrier plate provided with an accommodating groove, a coolant inlet, and a coolant outlet; wherein:
the jet plate is provided in the accommodating groove;
a plurality of nozzles are provided on the jet plate;
a distribution cavity is provided between the jet plate and the carrier plate, and the distribution cavity is configured to communicate with the coolant inlet;
the coolant inlet is configured to inject cooling liquid;
a collection cavity for backflow of the cooling liquid is formed in the accommodating groove, and the collection cavity is separated from the distribution cavity;
the coolant outlet is configured to communicate with the collection cavity and is configured for the cooling liquid to flow out of the collection cavity;
the cooling liquid is configured to be distributed to the jet plate through the distribution cavity, and sprayed to the collection cavity through at least one of the nozzles for heat exchange, and the cooling liquid obtained through the heat exchange is configured to be converged in the collection cavity and to flow out through the coolant outlet, and
at least two of the nozzles provided on the jet plate are different sizes, and the at two of the nozzles have different quantities of nozzle holes.