| CPC H05K 7/20272 (2013.01) [H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H05K 7/20927 (2013.01)] | 19 Claims |

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1. A cooling device, comprising:
a surface configured to receive a component to be cooled;
a cooling chamber inlet;
a common central rail fluidly coupled to the cooling chamber inlet;
a collection cavity;
a plurality of cooling units, fluidly coupled to the common central rail such that each of the plurality of cooling units extends and is fed from both opposite sides of the common central rail and the common central rail bisects each of the plurality of cooling units;
wherein each cooling unit of the plurality of cooling units is located adjacent to the surface and comprises a passageway fluidly coupled to the common central rail and the collection cavity; and
wherein the cooling device is configured for a coolant fluid to only flow sequentially from the common central rail, through the plurality of cooling units and to the collection cavity;
a cooling chamber outlet fluidly coupled to the collection cavity.
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