US 12,414,262 B2
Electronic device having cooling module and method for controlling cooling module thereof
Jeongwon Park, Gyeonggi-do (KR); Chulkwi Kim, Gyeonggi-do (KR); Younsang Yoo, Gyeonggi-do (KR); Jongmin Yoon, Gyeonggi-do (KR); Chanmin Park, Gyeonggi-do (KR); and Donghyun Yeom, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Jul. 8, 2022, as Appl. No. 17/860,281.
Application 17/860,281 is a continuation of application No. PCT/KR2021/014800, filed on Oct. 21, 2021.
Claims priority of application No. 10-2020-0136897 (KR), filed on Oct. 21, 2020.
Prior Publication US 2022/0346268 A1, Oct. 27, 2022
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 5/00 (2006.01)
CPC H05K 7/20209 (2013.01) [G06F 1/20 (2013.01); G06F 1/206 (2013.01); H05K 5/0086 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a housing including an inner space for accommodating an external electronic device therein;
a battery disposed in the housing;
a detection module disposed in the housing, and configured to detect one of accommodating or removal of the external electronic device from the inner space;
a communication module disposed in the housing, and configured to receive at least one of an operational state information or temperature information for the external electronic device from the external electronic device;
at least two cooling modules disposed in the housing, the at least two cooling modules including a first cooling module positioned at a first side of the housing and a second cooling module positioned at a second side of the housing;
at least one processor operatively coupled with the detection module, the communication module and the at least two cooling modules; and
memory operatively coupled with the at least one processor,
wherein the memory stores instructions which, when executed by the at least one processor, cause the electronic device to:
detect, through the detection module, that the external electronic device is accommodated in the housing,
receive at least one of the operational state information or temperature information for the external electronic device through the communication module while the external electronic device is being accommodated,
control each one of the at least two cooling modules based on the operational state information or the temperature information; and
control each one of the at least two cooling modules to change an air flow direction among a plurality of possible air flow directions for dissipating heat generated from the external electronic device to outside of the housing by changing whether air ingresses or egresses the housing through at least one of the at least two cooling modules.