US 12,414,239 B2
Methods for producing an etch resist pattern on a metallic surface
Moshe Frenkel, Jerusalem (IL); and Nava Shpaisman, Kedumim (IL)
Assigned to Kateeva, Inc., Newark, CA (US)
Filed by Kateeva, Inc., Newark, CA (US)
Filed on Feb. 6, 2023, as Appl. No. 18/164,798.
Application 18/164,798 is a continuation of application No. 16/912,818, filed on Jun. 26, 2020, granted, now 11,606,863.
Application 16/912,818 is a continuation of application No. 15/578,300, granted, now 10,743,420, issued on Aug. 11, 2020, previously published as PCT/IL2016/050567, filed on Jun. 2, 2016.
Claims priority of provisional application 62/170,713, filed on Jun. 4, 2015.
Prior Publication US 2023/0189447 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 3/06 (2006.01); C09D 11/54 (2014.01); C23F 1/02 (2006.01); C23F 1/18 (2006.01); G03F 7/00 (2006.01)
CPC H05K 3/062 (2013.01) [C09D 11/54 (2013.01); C23F 1/02 (2013.01); C23F 1/18 (2013.01); H05K 3/061 (2013.01); G03F 7/0002 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method comprising:
depositing a first aqueous composition comprising a first reactive component comprising a reactive polymer, a long-chain quaternary amine, or a metal cation onto a substrate;
depositing a second aqueous composition comprising a second reactive component comprising an anionic material onto the substrate, wherein, upon contact between the first aqueous composition and the second aqueous composition, the first reactive component chemically reacts with the second reactive component to form an immobilized bi-component mask, wherein one or more of depositing the first aqueous composition and depositing the second aqueous composition is a patterned deposition comprising non-impact printing, and one or more of the first aqueous composition and the second aqueous composition is deposited directly onto a metallic layer of the substrate;
removing unreacted portions of the first aqueous composition, the second aqueous composition, or both to expose portions of the metallic layer; and
depositing an etch solution to remove the exposed portions of the metallic layer.