US 12,414,235 B2
Circuit board structure and manufacturing method thereof
Chun Hung Kuo, Taoyuan (TW); Kuo-Ching Chen, Taoyuan (TW); Yu-Cheng Huang, Taoyuan (TW); and Yu-Hua Chen, Taoyuan (TW)
Assigned to UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)
Filed by UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)
Filed on Jul. 11, 2023, as Appl. No. 18/220,548.
Claims priority of application No. 112118639 (TW), filed on May 19, 2023.
Prior Publication US 2024/0389232 A1, Nov. 21, 2024
Int. Cl. H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 3/36 (2006.01)
CPC H05K 1/142 (2013.01) [H05K 1/165 (2013.01); H05K 3/368 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10265 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A circuit board structure, comprising:
a first circuit board, having a first side surface and a first cavity located on the first side surface;
a second circuit board, having a second side surface facing the first side surface and being spaced apart from the first side surface;
a conductive coil, in a spiral shape and comprising a first coil pattern and a second coil pattern, wherein the first coil pattern is disposed in the first circuit board, the second coil pattern is disposed in the second circuit board, and the first coil pattern is electrically connected to the second coil pattern;
a first magnetic body, filled in the first cavity of the first circuit board, the conductive coil surrounding at least a part of the first magnetic body; and
a molding compound, filled in a gap between the first side surface and the second side surface,
wherein the first side surface and the second side surface are parallel to a height direction of the first magnetic body.