US 12,414,233 B2
Circuit board
Dong Hwa Lee, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/793,100
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Jan. 13, 2021, PCT No. PCT/KR2021/000455
§ 371(c)(1), (2) Date Jul. 15, 2022,
PCT Pub. No. WO2021/145664, PCT Pub. Date Jul. 22, 2021.
Claims priority of application No. 10-2020-0006073 (KR), filed on Jan. 16, 2020.
Prior Publication US 2023/0047621 A1, Feb. 16, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/05 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/38 (2013.01); H05K 3/40 (2013.01); H05K 1/0207 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a first substrate structure including a first insulating layer and an upper pad disposed on an upper surface of the first insulating layer;
a second substrate structure disposed on the first substrate structure; and
an adhesive layer disposed between the first substrate structure and the second substrate structure,
wherein the second substrate structure includes:
a second insulating layer including a via hole;
a conductive via disposed in the via hole; and
a metal layer including a first part disposed on an upper surface of the second insulating layer, a second part disposed on a lower surface of the second insulating layer, and a third part disposed on an inner wall of the via hole of the conductive via,
wherein the conductive via includes a first via portion disposed in the via hole and overlapping the first to third parts of the metal layer along a horizontal direction, and a second via portion protruding from the first via portion toward the first substrate structure and not overlapping the first to third parts of the metal layer along the horizontal direction and a vertical direction perpendicular to the horizontal direction, and
wherein the adhesive layer includes a first adhesive portion disposed between the first insulating layer and the second insulating layer, and a second adhesive portion disposed between the third part of the metal layer and the upper pad and surrounding the second via portion of the conductive via.