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1. A substrate structure, comprising: a substrate body including at least one insulating layer and a plurality of circuit layers bonded to the insulating layer, wherein the insulating layer is formed with a plurality of conductive blind vias electrically connected to the plurality of circuit layers; at least one first electrical contact pad disposed on the insulating layer, wherein the first electrical contact pad includes a first pad portion disposed on the insulating layer and at least one first protruding portion embedded in the insulating layer, and wherein the first pad portion is electrically connected to the circuit layer by the conductive blind via connected thereto, and the first protruding portion is free from being connected to the circuit layer; and a metal block formed on the insulating layer, wherein the metal block is free from being electrically connected to the circuit layer, wherein a volume of the metal block is equal to a volume of the first electrical contact pad and the conductive blind via connected thereto; at least one second electrical contact pad located on the insulating layer, wherein the second electrical contact pad is free from having a protruding portion, and wherein a volume of the second electrical contact pad and the conductive blind via connected thereto is equal to a volume of the first electrical contact pad and the conductive blind via connected thereto, and wherein an outermost surface of the second electrical contact pad is coplanar with an outermost surface of the first electrical contact pad.
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