US 12,414,228 B2
Printed circuit board with electromagnetic bandgap structure for launcher in package devices
Manuel Alfredo Monedero Miranda, Munich (DE); and Holger Kuhnert, Munich (DE)
Assigned to NXP B.V., Eindhoven (NL)
Filed by NXP B.V., Eindhoven (NL)
Filed on Dec. 7, 2022, as Appl. No. 18/076,821.
Prior Publication US 2024/0196520 A1, Jun. 13, 2024
Int. Cl. H05K 1/02 (2006.01); H01Q 1/52 (2006.01); H05K 3/12 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0236 (2013.01) [H01Q 1/52 (2013.01); H05K 3/12 (2013.01); H01L 23/49827 (2013.01); H05K 1/181 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10378 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) for a launcher in package (LiP) device, the PCB comprising:
a first surface that faces an integrated circuit (IC) chip package of the LiP;
a second surface that faces an antenna structure of the LiP; and
an electromagnetic bandgap (EBG) structure on the second surface, the EBG structure comprising a plurality of EBG elements, wherein:
the IC chip package includes a radio frequency (RF) IC chip package with a plurality of RF launchers;
the antenna structure includes a plurality of antenna elements, each antenna element of the plurality of antenna elements corresponding to a respective RF launcher of the plurality of RF launchers;
the PCB comprises a plurality of vias, each via of the plurality of vias coupling a respective antenna element of the antenna structure with a corresponding RF launcher of the plurality of RF launchers, wherein the plurality of EBG elements borders at least one side of one via of the plurality of vias.