| CPC H05K 1/0203 (2013.01) [H05K 7/20254 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01)] | 10 Claims |

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1. An inlet heat sink for a liquid cooling system of an electronic board, said electronic board comprising at least one electronic component, said liquid cooling system comprising a cold plate that receives said inlet heat sink, said cold plate being dimensioned to cover at least part of said electronic board and comprising a cooling circuit comprising channels inside of which a cold heat transfer fluid flows, to supply at least said inlet heat sink, and a discharge circuit comprising channels inside of which a hot heat transfer fluid having been heated through the inlet heat sink, wherein the inlet heat sink comprises:
a cooling block comprising a lower part constituting a main heat exchange zone and an upper part connected to the cold plate,
a cold inlet connector fluidly connected to the upper part of said cooling block and which is to receive an inlet tube of the cooling circuit such that said cooling block is supplied by heat transfer fluid from the cold plate,
a hot outlet connector,
a cold outlet connector, the upper part of the cooling block being configured to divide a flow of said heat transfer fluid entering through the cold inlet connector into
a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic board by being routed to the hot outlet connector, and
a second flow, oriented directly towards the cold outlet connector.
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