US 12,413,909 B2
Package structure of micro speaker
Yu-Xuan Xu, Hsinchu (TW); and Shih-Chin Gong, Taipei (TW)
Assigned to FORTEMEDIA, INC., Alviso, CA (US)
Filed by Fortemedia, Inc., Alviso, CA (US)
Filed on Apr. 18, 2023, as Appl. No. 18/302,207.
Prior Publication US 2024/0357294 A1, Oct. 24, 2024
Int. Cl. H04R 7/04 (2006.01); H04R 1/02 (2006.01); H04R 9/02 (2006.01); H04R 9/04 (2006.01); H04R 9/06 (2006.01)
CPC H04R 7/04 (2013.01) [H04R 1/025 (2013.01); H04R 9/025 (2013.01); H04R 9/047 (2013.01); H04R 9/06 (2013.01); H04R 2201/003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure of a micro speaker, comprising: a substrate having a hollow chamber; a membrane, disposed on the substrate, covering the hollow chamber;
a multi-layers coil includes a first metal layer and a second metal layer embedded in the membrane, wherein the coil comprises: a spiral structure located in a center of the membrane; and a wavy structure extending from the spiral structure to a periphery of the membrane; and a magnetic element disposed in the hollow chamber, wherein a vent hole is formed in and penetrates the membrane, and in a top view, the vent hole is separated from the coil, located on a side opposite to the wavy structure, and is in fluid communication with and is aligned communicates with and overlaps with the hollow chamber.