US 12,413,899 B2
Integrated speaker and mobile terminal
Lei Huang, Nanjing (CN); and Hongxing Wang, Nanjing (CN)
Assigned to AAC Technologies (Nanjing) Co., Ltd., Nanjing (CN)
Filed by AAC Technologies (Nanjing) Co., Ltd., Nanjing (CN)
Filed on May 26, 2023, as Appl. No. 18/324,180.
Application 18/324,180 is a continuation of application No. PCT/CN2023/086800, filed on Apr. 7, 2023.
Claims priority of application No. 202211632068.2 (CN), filed on Dec. 19, 2022.
Prior Publication US 2024/0205592 A1, Jun. 20, 2024
Int. Cl. H04R 1/28 (2006.01); H04R 1/02 (2006.01)
CPC H04R 1/2811 (2013.01) [H04R 1/025 (2013.01); H04R 1/028 (2013.01); H04R 2499/11 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An integrated speaker, comprising:
a housing with an accommodation cavity;
a heat dissipation assembly provided in the accommodation cavity;
a sounding assembly provided in the accommodation cavity and spaced from the heat dissipation assembly, comprising:
a sounding driver provided in the housing; and
a cover plate at least partially attached to the housing, wherein a rear cavity is formed between the cover plate and the sounding driver, and a front cavity is formed between the sounding driver and the housing; wherein
the housing is provided with a sound outlet hole connected to the front cavity, and a partition plate separating the accommodation cavity into a first cavity and a second cavity; a side wall of the housing is provided with a first through-hole connected to the first cavity, and a second through-hole connected to the second cavity; the heat dissipation assembly is provided in the first cavity; the heat dissipation assembly is configured to drive air from the second cavity to the first cavity, or, the heat dissipation assembly is configured to drive air from the first cavity to the second cavity; the heat dissipation assembly comprises a heat conducting plate capped at an opening of the housing, a heat dissipation member provided on the heat conducting plate and located in the first cavity, and a fan assembly provided on the heat dissipation member; wherein the heat dissipation member comprises a base plate attached to the heat conducting plate and a heat dissipation structure attached to the base plate and surrounding an outer side of the fan assembly; a plurality of gaps are formed in the heat dissipation structure; and the fan assembly is configured to drive air from the second cavity to the first cavity through the plurality of gaps.