US 12,413,832 B2
Substrate inspection apparatus, substrate inspection method, and recording medium
Daisuke Kajiwara, Koshi (JP); Tadashi Nishiyama, Koshi (JP); and Hiroshi Tomita, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jan. 11, 2023, as Appl. No. 18/152,887.
Claims priority of application No. 2022-002787 (JP), filed on Jan. 12, 2022.
Prior Publication US 2023/0224559 A1, Jul. 13, 2023
Int. Cl. G06T 7/00 (2017.01); G01N 21/00 (2006.01); H04N 23/13 (2023.01); H04N 23/45 (2023.01); H04N 23/56 (2023.01)
CPC H04N 23/13 (2023.01) [G06T 7/0004 (2013.01); H04N 23/45 (2023.01); H04N 23/56 (2023.01); G06T 2207/10024 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/20221 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30164 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A substrate inspection apparatus configured to inspect a substrate with an image obtained by imaging a surface of the substrate, the substrate inspection apparatus comprising:
a holder configured to hold the substrate and to be moved in a horizontal direction;
a first light source unit configured to emit visible light to the substrate held by the holder;
a second light source unit configured to emit infrared light to the substrate held by the holder;
a first imaging sensor configured to capture a visible light image of the surface of the substrate by receiving first reflected light emitted from the substrate as a result of radiating the visible light;
a second imaging sensor configured to capture an infrared light image of the surface of the substrate by receiving second reflected light emitted from the substrate as a result of radiating the infrared light; and
a controller configured to perform an inspection of the substrate by using the visible light image and the infrared light image, by capturing the visible light image with the first imaging sensor and capturing the infrared light image with the second imaging sensor in parallel as the holder is moving, thereby reducing a capture time of the first and second imaging sensors.