US 12,413,747 B2
Submesh coding for dynamic mesh coding
Youngkwon Lim, Mckinney, TX (US); Rajan Laxman Joshi, San Diego, CA (US); and Madhukar Budagavi, Plano, TX (US)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 20, 2023, as Appl. No. 18/391,526.
Claims priority of provisional application 63/438,732, filed on Jan. 12, 2023.
Claims priority of provisional application 63/439,459, filed on Jan. 17, 2023.
Claims priority of provisional application 63/440,009, filed on Jan. 19, 2023.
Claims priority of provisional application 63/442,347, filed on Jan. 31, 2023.
Claims priority of provisional application 63/459,873, filed on Apr. 17, 2023.
Claims priority of provisional application 63/542,897, filed on Oct. 6, 2023.
Prior Publication US 2024/0244232 A1, Jul. 18, 2024
Int. Cl. H04N 19/17 (2014.01)
CPC H04N 19/17 (2014.11) 17 Claims
OG exemplary drawing
 
8. A method for reconstructing a three-dimensional (3D) sub-mesh of a 3D mesh comprising:
receiving a compressed bitstream including a supplemental enhancement information (SEI) message including association information between scene objects and submeshes, wherein the association information includes a plurality of indices of the scene objects and a plurality of identifiers of the plurality of submeshes each being associated with a respective one index of the plurality of indices of the scene objects;
determining an index of the scene object;
decoding the SEI message to obtain the association information between scene objects and submeshes;
determining an identifier of a submesh based on the index of the scene object and the association information; and
reconstructing the submesh based on the identifier.