| CPC H02S 40/425 (2014.12) | 18 Claims |

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1. An electronic apparatus, comprising:
a circuit board having a first surface and a second surface opposite to each other, wherein a first heat dissipation region is provided on the first surface and a second heat dissipation region is provided on the second surface;
a heat dissipation housing, comprising a first heat dissipation member and a second heat dissipation member; and
an insulation member, wrapping the heat dissipation housing, wherein
the first heat dissipation member has a first heat dissipation surface, and the first heat dissipation surface is in direct contact with the first heat dissipation region;
the second heat dissipation member is connected to the first heat dissipation member, the second heat dissipation member has a second heat dissipation surface, and the second heat dissipation surface is in direct contact with the second heat dissipation region; and
the first heat dissipation region and the second heat dissipation region are sealed by using the first heat dissipation member and the second heat dissipation member.
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