| CPC H01R 13/6592 (2013.01) [H01R 13/514 (2013.01); H01R 13/516 (2013.01); H01R 13/6582 (2013.01); H01R 13/6586 (2013.01)] | 20 Claims |
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1. A wafer assembly for an electrical connector, the wafer assembly comprising:
a leadframe having signal contacts extending between mating ends and terminating ends, the signal contacts having main bodies between the mating ends and the terminating ends;
cables rearward of the leadframe, each cable including first and second signal conductors arranged as a signal pair, the first and second signal conductors being terminated to the terminating ends of the corresponding signal contacts at termination regions, each cable includes a cable shield providing shielding for the signal pair;
a wafer body holding the signal contacts, the wafer body having a front, a rear, a first side between the front and the rear, and a second side between the front and the rear, the cables and termination regions located rearward of the rear of the wafer body, wherein the wafer body supports the main bodies of the signal contacts, the mating ends extending forward of the front of the wafer body, the terminating ends extending rearward of the rear of the wafer body into the termination regions;
a first ground frame coupled to the first side of the wafer body to provide electrical shielding for the leadframe, the first ground frame including first ground shields providing shielding for the mating ends of the corresponding signal contacts, the first ground frame including first cable covers covering the termination regions, the first cable covers coupled to the corresponding cable shields; and
a second ground frame coupled to the second side of the wafer body to provide electrical shielding for the leadframe, the second ground frame including second cable covers covering the termination regions, the second cable covers coupled to the corresponding cable shields.
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14. A wafer assembly for an electrical connector, the wafer assembly comprising:
a leadframe having signal contacts extending between mating ends and terminating ends, the signal contacts having main bodies between the mating ends and the terminating ends;
cables rearward of the leadframe, each cable including first and second signal conductors arranged as a signal pair, the first and second signal conductors terminated to the terminating ends of the corresponding signal contacts, each cable includes a cable shield providing shielding for the signal pair, each cable shield having a first side, a second side, a top end transitioning between the first and second sides, and a bottom end transitioning between the first and second sides;
a wafer body holding the signal contacts, the wafer body having a front, a rear, a first side between the front and the rear, and a second side between the front and the rear, the cables located rearward of the rear of the wafer body, wherein the wafer body supports the main bodies of the signal contacts, the mating ends extending forward of the front of the wafer body, the terminating ends extending rearward of the rear of the wafer body;
a first ground frame coupled to the first side of the wafer body to provide electrical shielding for the leadframe, the first ground frame includes a first ground plate along the first side of the wafer body, the first ground frame including first ground shields extending forward of the first ground plate and providing shielding for the mating ends of the corresponding signal contacts, the first ground frame including first cable covers extending rearward of the first ground plate and coupled to the corresponding cable shields, each first cable cover including a first central spine, a first upper wing, and a first lower wing, the first central spine coupled to the first side of the corresponding cable shield, the first upper wing coupled to the upper end of the corresponding cable shield, the first lower wing coupled to the lower end of the corresponding cable shield; and
a second ground frame coupled to the second side of the wafer body to provide electrical shielding for the leadframe, the second ground frame includes a second ground plate along the second side of the wafer body, the second ground frame including second cable covers extending rearward of the second ground plate and coupled to the corresponding cable shields, each second cable cover including a second central spine, a second upper wing, and a second lower wing, the second central spine coupled to the second side of the corresponding cable shield, the second upper wing coupled to the upper end of the corresponding cable shield, the second lower wing coupled to the lower end of the corresponding cable shield.
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20. An electrical connector assembly comprising:
a housing having a mating interface configured to be mated with a mating electrical connector assembly, the housing having a cavity; and
wafer assemblies received in the cavity and coupled to the housing, the wafer assemblies arranged in a wafer stack, each wafer assembly including a leadframe, a wafer body holding the leadframe, cables coupled to the leadframe at termination regions, a first ground frame coupled to the wafer body to provide electrical shielding for the leadframe, and a second ground frame coupled to the wafer body to provide electrical shielding for the leadframe, wherein the first ground frame covers the termination regions and is coupled to cable shields of each of the cables and the second ground frame covers the termination regions and is coupled to the cable shields of each of the cables, and wherein the first ground frame is configured to be coupled to the mating electrical connector assembly and the second ground frame is configured to be coupled to the mating electrical connector assembly.
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