US 12,413,001 B2
Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package
Zhichao Zhang, Chandler, AZ (US); Zhe Chen, Chandler, AZ (US); Steven A. Klein, Chandler, AZ (US); Feifei Cheng, Chandler, AZ (US); Srikant Nekkanty, Chandler, AZ (US); Kemal Aygun, Tempe, AZ (US); Michael E. Ryan, Fountain Hills, AZ (US); and Pooya Tadayon, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 18, 2021, as Appl. No. 17/352,103.
Prior Publication US 2022/0407254 A1, Dec. 22, 2022
Int. Cl. H01R 43/16 (2006.01); H01R 12/72 (2011.01); H01R 13/17 (2006.01); B81B 1/00 (2006.01)
CPC H01R 12/724 (2013.01) [H01R 12/721 (2013.01); H01R 13/17 (2013.01); H01R 43/16 (2013.01); B81B 1/00 (2013.01); B81B 2201/07 (2013.01); B81B 2207/07 (2013.01); H01R 2201/06 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A microelectronic socket structure comprising:
a socket structure housing defining a cavity therein; and
an interconnection structure including:
a contact element at least in part within the cavity, and to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and
a conductive structure at least in part within the cavity and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.
 
15. An microelectronic system comprising:
a microelectronic package containing package circuitry, and package contacts configured to provide signals and ground to the package circuitry;
a motherboard containing motherboard circuitry and motherboard contacts configured to provide signals and ground between the motherboard circuitry and the package circuitry; and
a microelectronic socket structure between the package and the motherboard and including:
a socket structure housing defining a plurality of cavities therein; and
a plurality of interconnection structures, individual ones of the interconnection structures including:
a contact element at least in part within a corresponding one of the cavities, and electrically coupled to a corresponding one of the package contacts and the motherboard contacts, the contact element further including one of a signal contact element or a ground contact element; and
a conductive structure at least in part within a corresponding one of the cavities and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.
 
20. A computing system including:
a memory; and
a processors coupled to the memory and including an microelectronic system that comprises:
a microelectronic package containing package circuitry, and package contacts configured to provide signals and ground to the package circuitry;
a motherboard containing motherboard circuitry and motherboard contacts configured to provide signals and ground between the motherboard circuitry and the package circuitry; and
a microelectronic socket structure between the package and the motherboard and including:
a socket structure housing defining a plurality of cavities therein; and
a plurality of interconnection structures, individual ones of the interconnection structures including:
a contact element at least in part within a corresponding one of the cavities, and electrically coupled to a corresponding one of the package contacts and the motherboard contacts, the contact element further including one of a signal contact element or a ground contact element; and
a conductive structure at least in part within a corresponding one of the cavities and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.
 
23. A method of fabricating a socket structure for a microelectronic system, the method including:
providing a cavity in a socket housing made of a dielectric material;
providing an interconnection structure including:
a contact element at least in part within the cavity, and to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and
a conductive structure at least in part within the cavity and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.