US 12,412,975 B2
Electronic device including interposing board for antenna
Juneseok Lee, Suwon-si (KR); Kwanghyun Baek, Suwon-si (KR); Dohyuk Ha, Suwon-si (KR); Jungho Park, Suwon-si (KR); Sangho Lee, Suwon-si (KR); Youngju Lee, Suwon-si (KR); and Wuseong Lee, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 16, 2023, as Appl. No. 18/185,085.
Application 18/185,085 is a continuation of application No. PCT/KR2022/010274, filed on Jul. 14, 2022.
Claims priority of application No. 10-2021-0093647 (KR), filed on Jul. 16, 2021.
Prior Publication US 2023/0216180 A1, Jul. 6, 2023
Int. Cl. H01Q 1/24 (2006.01); H01Q 1/22 (2006.01)
CPC H01Q 1/246 (2013.01) [H01Q 1/2283 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio unit (RU) device comprising:
a first printed circuit board (PCB) on which a plurality of antenna elements are disposed;
a second PCB on which a radio frequency integrated circuit (RFIC) is disposed; and
a third PCB disposed between the first PCB and the second PCB,
wherein the third PCB is configured to electrically connect each of the plurality of antenna elements disposed on the first PCB and the RFIC disposed on the second PCB,
wherein a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and
wherein positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.