US 12,412,879 B2
Package structure and manufacturing method thereof
John Hon-Shing Lau, Taoyuan (TW); and Tzyy-Jang Tseng, Taoyuan (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Jun. 9, 2023, as Appl. No. 18/331,943.
Application 18/331,943 is a continuation in part of application No. 17/835,990, filed on Jun. 9, 2022, granted, now 11,860,428.
Prior Publication US 2023/0402441 A1, Dec. 14, 2023
Int. Cl. H01L 25/16 (2023.01); G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/38 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/167 (2013.01) [G02B 6/4271 (2013.01); H01L 23/36 (2013.01); H01L 23/38 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/50 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a circuit board;
a package substrate disposed on the circuit board and electrically connected to the circuit board;
an electronic/photonic assembly comprising an application specific integrated circuit (ASIC) assembly, an electronic integrated circuit (EIC) assembly, and a photonic integrated circuit (PIC) assembly, wherein the ASIC assembly is disposed on the package substrate and electrically connected to the package substrate, and the EIC assembly and the PIC assembly are stacked and disposed on the package substrate and electrically connected to the package substrate;
a film redistribution layer disposed only between the EIC assembly and the PIC assembly, wherein the EIC assembly and the PIC assembly are electrically connected to the package substrate via the film redistribution layer, and an orthographic projection of the EIC assembly on the film redistribution layer is overlapped with an orthographic projection of the PIC assembly on the film redistribution layer;
a heat dissipation assembly disposed on the electronic/photonic assembly; and
an optical fiber assembly disposed on the package substrate and optically connected to the PIC assembly.