US 12,412,874 B2
Pixel array package structure and display panel
Hui-Ru Wu, Hsinchu (TW); Jian-Chin Liang, Hsinchu (TW); Jo-Hsiang Chen, Hsinchu (TW); Lung-Kuan Lai, Hsinchu (TW); Cheng-Yu Tsai, Hsinchu (TW); Hsin-Lun Su, Hsinchu (TW); and Ting-Kai Chen, Hsinchu (TW)
Assigned to Lextar Electronics Corporation, Hsinchu (TW)
Filed by Lextar Electronics Corporation, Hsinchu (TW)
Filed on Sep. 4, 2023, as Appl. No. 18/460,673.
Application 17/663,431 is a division of application No. 16/232,041, filed on Dec. 25, 2018, granted, now 11,367,849, issued on Jun. 21, 2022.
Application 18/460,673 is a continuation of application No. 17/663,431, filed on May 15, 2022, granted, now 11,778,845.
Claims priority of application No. 107129351 (TW), filed on Aug. 22, 2018.
Prior Publication US 2023/0413594 A1, Dec. 21, 2023
Int. Cl. H01L 25/075 (2006.01); H10H 20/856 (2025.01); H10K 50/125 (2023.01); H10K 50/80 (2023.01); H10K 50/856 (2023.01); H10K 50/86 (2023.01); H10K 59/80 (2023.01)
CPC H01L 25/0753 (2013.01) [H10H 20/856 (2025.01); H10K 50/125 (2023.02); H10K 50/856 (2023.02); H10K 50/865 (2023.02); H10K 50/868 (2023.02); H10K 59/878 (2023.02); H10K 59/8792 (2023.02); H10K 59/8793 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A pixel array package structure, comprising:
a substrate;
a pixel array disposed on the substrate, wherein the pixel array comprises a plurality of light emitting diode chips, and the plurality of light emitting diode chips comprise a red diode chip, a green diode chip, a blue diode chip, and a combination thereof;
a reflective layer disposed on the substrate and between any two adjacent of the plurality of light emitting diode chips;
a light-absorbing layer embedded in the reflective layer and surrounding the pixel array; and
a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, wherein the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array.