US 12,412,869 B2
Electronic structure having first and second thermal conductive materials covering conductive bumps and manufacturing method thereof, and electronic package having electronic structure and manufacturing method thereof
Yi-Ling Chen, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Dec. 8, 2022, as Appl. No. 18/063,115.
Claims priority of application No. 111129577 (TW), filed on Aug. 5, 2022.
Prior Publication US 2024/0047420 A1, Feb. 8, 2024
Int. Cl. H01L 25/065 (2023.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 25/0655 (2013.01) [H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81815 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An electronic structure, comprising:
an electronic body being a semiconductor substrate and having a first surface and a second surface opposing the first surface;
a plurality of conductive bumps disposed on the first surface of the electronic body; and
a thermal conductor disposed on the first surface of the electronic body and including a first thermal conductive material contacting peripheral surfaces of the plurality of conductive bumps to cover the plurality of conductive bumps, and a second thermal conductive material adjacent to the first thermal conductive material, wherein the second thermal conductive material is separated from the plurality of conductive bumps by the first thermal conductive material, wherein a thermal conductivity of the second thermal conductive material is greater than a thermal conductivity of the first thermal conductive material.