US 12,412,866 B2
Back plate and manufacturing method thereof, method for bonding chip, and display device
Guangcai Yuan, Beijing (CN); Zhiwei Liang, Beijing (CN); Ke Wang, Beijing (CN); and Zhanfeng Cao, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/418,809
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Oct. 19, 2020, PCT No. PCT/CN2020/121888
§ 371(c)(1), (2) Date Jun. 26, 2021,
PCT Pub. No. WO2021/078095, PCT Pub. Date Apr. 29, 2021.
Claims priority of application No. 201911008405.9 (CN), filed on Oct. 22, 2019.
Prior Publication US 2022/0068873 A1, Mar. 3, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10D 86/01 (2025.01); H10H 20/831 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01)
CPC H01L 24/81 (2013.01) [H01L 25/167 (2013.01); H10D 86/021 (2025.01); H10H 20/831 (2025.01); H10H 20/857 (2025.01); H01L 2224/11466 (2013.01); H01L 2224/11614 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/1318 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/81345 (2013.01); H01L 2224/8182 (2013.01); H01L 2924/12041 (2013.01); H10H 20/0364 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A back plate, comprising:
a base substrate;
a plurality of conductive connecting tubes disposed on the base substrate, wherein one end of each of the conductive connecting tubes is connected to the base substrate, and a side wall of each of the conductive connecting tubes is provided with an opening penetrating the side wall;
a thin film transistor which is disposed on the base substrate, wherein the plurality of conductive connecting tubes comprises a first conductive connecting tube disposed on a side of the thin film transistor away from the base substrate, and the first conductive connecting tube is electrically connected to the thin film transistor; and
a common electrode which is disposed on the base substrate, wherein the plurality of conductive connecting tubes further comprises a second conductive connecting tube disposed on a side of the common electrode away from the base substrate, and the second conductive connecting tube is electrically connected to the common electrode.