US 12,412,865 B2
Apparatus and method for bonding substrates
Dominik Zinner, Zell an der Pram (AT); Thomas Wagenleitner, Aurolzmunster (AT); Jurgen Markus Suss, Scharding (AT); Thomas Plach, St. Florian am Inn (AT); and Jurgen Mallinger, Senftenbach (AT)
Assigned to EV GROUP E. THALLNER GMBH, St. Florian am Inn (AT)
Filed by EV Group E. Thallner GmbH, St. Florian am Inn (AT)
Filed on Feb. 15, 2022, as Appl. No. 17/671,732.
Application 17/671,732 is a division of application No. 16/632,643, granted, now 11,315,901, previously published as PCT/EP2017/073930, filed on Sep. 21, 2017.
Prior Publication US 2022/0173068 A1, Jun. 2, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/6833 (2013.01); H01L 21/6838 (2013.01); H01L 24/83 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75724 (2013.01); H01L 2224/75725 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/7592 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83908 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A device for bonding a first substrate to a second substrate at mutually facing contact surfaces of the first and second substrates, said device comprising:
a first chuck configured to mount the first substrate;
a second chuck configured to mount the second substrate;
a first plate arranged between the second substrate and the second chuck; and
bend-changing means configured to deform the first plate with the second substrate with respect to the second chuck,
wherein the deformation is controlled during bonding of the first substrate to the second substrate,
wherein the second chuck has first limiting elements configured to mechanically fix the first plate in a circumferential region on the first plate, and
wherein a thickness of the first plate is in a range between 0.1 mm and 10 mm.