US 12,412,847 B2
Semiconductor module, semiconductor device and vehicle
Tomoyuki Wakiyama, Nagano (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kanagawa (JP)
Filed by Fuji Electric Co., Ltd., Kanagawa (JP)
Filed on Feb. 2, 2023, as Appl. No. 18/163,486.
Claims priority of application No. 2022-039505 (JP), filed on Mar. 14, 2022.
Prior Publication US 2023/0290741 A1, Sep. 14, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 23/15 (2013.01); H01L 23/3121 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor module, comprising:
a wiring board including a ceramic substrate and conductor patterns on a first surface of the ceramic substrate;
a semiconductor element arranged on at least one of the conductor patterns on the first surface of the ceramic substrate;
a sealing insulator that seals the wiring board and the semiconductor element; and
an insulating member adhered on the first surface of the ceramic substrate in a gap between the conductor patterns that are adjacent to each other, the insulating member extending in an extending direction of the gap and dividing an area in the gap where the sealing insulator fills the gap so that the insulating member is laterally separate from respective edges of the conductor patterns adjacent to each other.