US 12,412,845 B2
Semiconductor packages and methods of manufacturing the same
Cheng Yuan Chen, Kaohsiung (TW); Jiming Li, Kaohsiung (TW); Chun Chen Chen, Kaohsiung (TW); and Yuanhao Yu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jan. 10, 2023, as Appl. No. 18/095,513.
Application 18/095,513 is a continuation of application No. 16/264,599, filed on Jan. 31, 2019, granted, now 11,552,026.
Prior Publication US 2023/0145588 A1, May 11, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a substrate;
an electronic component disposed over the substrate;
a radio frequency (RF) structure disposed over the substrate;
a first encapsulant disposed over the substrate and encapsulating the RF structure; and
a second encapsulant disposed over the substrate and in contact with the first encapsulant, wherein an interface is between the first encapsulant and the second encapsulant, wherein a top surface of the first encapsulant is parallel to a top surface of the second encapsulant, and wherein the RF structure comprises a feeding element and a plurality of shielding elements surrounding the feeding element.