US 12,412,834 B2
Triple-sided module
Dingyou Zhang, San Jose, CA (US); Christopher Paul Wade, Los Gatos, CA (US); Li Sun, San Jose, CA (US); and Chris Chung, San Jose, CA (US)
Assigned to Avago Technologies International Sales Pte. Limited, Palo Alto, CA (US)
Filed by Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed on Apr. 22, 2022, as Appl. No. 17/727,586.
Prior Publication US 2023/0343704 A1, Oct. 26, 2023
Int. Cl. H01L 23/528 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/5283 (2013.01) [H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/30 (2013.01); H01L 25/18 (2013.01); H01L 2224/17104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15311 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first substrate comprising one or more first interconnection layers, wherein a first die is coupled to a first side of the first substrate;
a second substrate comprising one or more second interconnection layers, wherein a second die is coupled to a first side of the second substrate, and a third die is coupled to a second side of the second substrate;
a first mold layer formed on the first side of the first substrate;
a second mold layer formed between the first and second substrate; and
a third mold layer formed on the second side of the second substrate;
wherein the first substrate and the second substrate are stacked together.