US 12,412,826 B2
Chip-on-film packages and display apparatuses including the same
Jungeun Koo, Hwaseong-si (KR); and Yechung Chung, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Oct. 31, 2022, as Appl. No. 18/051,141.
Application 18/051,141 is a division of application No. 16/874,120, filed on May 14, 2020, granted, now 11,508,651.
Claims priority of application No. 10-2019-0112367 (KR), filed on Sep. 10, 2019.
Prior Publication US 2023/0077996 A1, Mar. 16, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 22/32 (2013.01); H01L 23/49 (2013.01); H01L 23/4985 (2013.01); H01L 24/32 (2013.01); H01L 25/072 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 2224/32227 (2013.01); H01L 2924/1426 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display apparatus comprising:
a chip-on-film (COF) package having a base film;
a display panel that faces a first portion of a top surface of the base film; and
a driver printed circuit board (PCB) that faces a second portion of the top surface of the base film,
wherein the COF package comprises:
the base film;
a source driver chip and a gate driver chip each mounted on the top surface of the base film;
a first conductive line on the top surface of the base film, a second conductive line on a bottom surface of the base film, and a conductive via that electrically connects the first and second conductive lines to each other;
a first row of bonding pads on the top surface of the base film and electrically connected to the source driver chip; and
a second row of bonding pads on the top surface of the base film and electrically connected to the source driver chip and the gate driver chip.