| CPC H01L 23/49822 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/367 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/73 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3511 (2013.01)] | 12 Claims |
|
1. An electronic package, comprising:
a package substrate having a plurality of main circuit layers;
a package module disposed on the package substrate and including:
a circuit structure disposed on the package substrate and having a plurality of auxiliary circuit layers electrically connected to the plurality of main circuit layers, wherein the circuit structure has a first surface and a second surface opposite to each other such that the second surface of the circuit structure is disposed on the package substrate, and a number of layers of the plurality of auxiliary circuit layers is used to replace a layer number configuration of the plurality of main circuit layers such that a number of layers of the plurality of main circuit layers is less than an original expected number of layers of the plurality of main circuit layers, and a sum of the number of layers of the plurality of auxiliary circuit layers and the number of layers of the plurality of main circuit layers is at least ten;
an electronic component disposed on the first surface of the circuit structure and electrically connected to the plurality of auxiliary circuit layers, wherein the circuit structure has a vertical projected area smaller than a vertical projection area of the package substrate; and
an encapsulant formed on the first surface of the circuit structure to encapsulate the electronic component,
wherein the plurality of auxiliary circuit layers have a single layer replacing 2 to 4 layers of the plurality of main circuit layers, and the original expected number of layers of the plurality of main circuit layers is at least sixteen.
|