| CPC H01L 23/49822 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/367 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/73 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3511 (2013.01)] | 9 Claims |
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1. A method for manufacturing an electronic package, comprising:
providing a circuit structure including a plurality of auxiliary circuit layers and a package substrate having a plurality of main circuit layers, wherein the circuit structure has a first surface and a second surface opposite to each other, and a number of layers of the plurality of auxiliary circuit layers is used to replace a layer number configuration of the plurality of main circuit layers such that a number of layers of the plurality of main circuit layers is less than an original expected number of layers of the plurality of main circuit layers;
disposing an electronic component on the first surface of the circuit structure and electrically connecting the electronic component with the plurality of auxiliary circuit layers, wherein the circuit structure extends out of sides of the electronic component;
forming an encapsulant on the first surface of the circuit structure to encapsulate the electronic component to obtain a package module;
disposing the second surface of the circuit structure of the package module on the package substrate having the plurality of main circuit layers via a plurality of conductive components, wherein the plurality of main circuit layers are electrically connected to the plurality of auxiliary circuit layers via the plurality of conductive components; and
forming a packaging material on the package substrate, wherein the packaging material covers the plurality of conductive components,
wherein the plurality of auxiliary circuit layers have a single layer replacing 2 to 4 layers of the plurality of main circuit layers, and the original expected number of layers of the plurality of main circuit layers is at least sixteen.
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