| CPC H01L 23/49811 (2013.01) [H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02379 (2013.01)] | 20 Claims |

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1. A device comprising:
a package component comprising:
first integrated circuit dies;
a redistribution structure on the first integrated circuit dies, an outer edge of the redistribution structure being disposed a first distance from a center of the redistribution structure in a cross-sectional view;
first sockets attached to the redistribution structure, the first sockets arranged in a grid in a top-down view; and
interposers attached to the redistribution structure, the interposers disposed around the grid of the first sockets in the top-down view, an inner edge of each of the interposers being disposed a second distance from the center of the redistribution structure in the cross-sectional view, an outer edge of each of the interposers being disposed a third distance from the center of the redistribution structure in the cross-sectional view, the second distance being less than the first distance, the third distance being greater than the first distance.
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