US 12,412,813 B2
Semiconductor module
Kensuke Takeuchi, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 17/794,870
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed May 19, 2020, PCT No. PCT/JP2020/019718
§ 371(c)(1), (2) Date Jul. 22, 2022,
PCT Pub. No. WO2021/234803, PCT Pub. Date Nov. 25, 2021.
Prior Publication US 2023/0096581 A1, Mar. 30, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H02M 1/00 (2007.01); H02M 7/5387 (2007.01)
CPC H01L 23/4952 (2013.01) [H01L 23/49562 (2013.01); H01L 23/58 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48265 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/19043 (2013.01); H02M 1/0009 (2021.05); H02M 7/53871 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a base plate having a shape of a sheet;
a relay plate having a shape of a sheet;
a terminal member;
an electronic component joined to one surface of the base plate; and
a mold resin sealing the base plate, the relay plate, the terminal member, the electronic component, and bonding wire, wherein
the base plate, the relay plate, and the terminal member are electrically conductive members and arranged as a same plane with gaps between the electrically conductive members,
the electronic component and one surface of the relay plate are connected to each other by a first bonding wire,
the one surface of the relay plate and one surface of the terminal member are connected to each other by a second bonding wire,
the relay plate has a shape of a rectangular sheet,
if a direction parallel to a long side of the relay plate is defined as a long side direction, each bonding wire is connected to a one-side portion or an other-side portion in the long side direction of the relay plate,
the mold resin is formed in an external shape that is a shape of a rectangular sheet having a sheet surface parallel to the same plane, and
the relay plate is disposed such that one long side thereof extends along a side surface of the mold resin.