US 12,412,810 B2
Single side via fill process for through-vias
Marvin Louis Bernt, Whitefish, MT (US); and Jon Woodyard, Livermore, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 25, 2022, as Appl. No. 17/705,239.
Prior Publication US 2023/0307320 A1, Sep. 28, 2023
Int. Cl. H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01)
CPC H01L 23/481 (2013.01) [H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/53238 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method of filling through-vias in a substrate, comprising:
coupling a first side of the substrate having through-vias to a carrier plate with an adhesive layer;
exposing the through-vias to a conductive layer disposed between the carrier plate and the first side of the substrate; and
plating the substrate using the conductive layer as a conductive seed layer to fill the through-vias with a conductive material; and at least one of:
further comprising detaching the carrier plate from the substrate by applying heat to the adhesive layer after plating the substrate and covering an upper surface of the substrate with an upper polymer layer and covering a lower surface of the substrate with a lower polymer layer to passivate and planarize the substrate; or
wherein the adhesive layer is a conductive adhesive layer used as the conductive seed layer.