US 12,412,802 B2
Heat dissipation structures for integrated circuit packages and methods of forming the same
Chih-Hao Chen, Taipei (TW); Po-Yuan Cheng, New Taipei (TW); Pu Wang, Hsinchu (TW); and Li-Hui Cheng, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Mar. 4, 2022, as Appl. No. 17/686,856.
Claims priority of provisional application 63/222,021, filed on Jul. 15, 2021.
Prior Publication US 2023/0014913 A1, Jan. 19, 2023
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4871 (2013.01); H01L 21/6836 (2013.01); H01L 23/3736 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/20 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/214 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a package component comprising an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component;
a heat dissipation layer on the back-side of the package component and on sidewalls of the package component;
an adhesive layer on a back-side of the heat dissipation layer, the adhesive layer further disposed on a first portion of a sidewall of the heat dissipation layer, a second portion of the sidewall of the heat dissipation layer being free from the adhesive layer; and
a package substrate comprising bond pads in contact with the conductive connectors, the package substrate being separated from the heat dissipation layer.