US 12,412,770 B2
Transfer component and manufacturing method thereof, and transfer head
Tao Wang, Chongqing (CN)
Assigned to CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD., Chongqing (CN)
Filed by CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD., Chongqing (CN)
Filed on Apr. 14, 2022, as Appl. No. 17/720,715.
Application 17/720,715 is a continuation of application No. PCT/CN2020/121903, filed on Oct. 19, 2020.
Prior Publication US 2022/0238368 A1, Jul. 28, 2022
Int. Cl. H01L 21/683 (2006.01); G03F 7/00 (2006.01)
CPC H01L 21/6835 (2013.01) [G03F 7/0015 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A manufacturing method for a transfer component, the transfer component being configured to transfer light-emitting diode (LED) chips, the manufacturing method comprising:
disposing an elastic adhesive layer on a surface of a substrate;
disposing a reticle on the elastic adhesive layer, the reticle comprising hollow areas and convex areas relative to the hollow areas;
etching the elastic adhesive layer through the hollow areas of the reticle to form a plurality of adhesive bumps used for transferring the LED chips by using the elastic adhesive layer, the convex areas corresponding to the plurality of adhesive bumps; and
obtaining the transfer component with the plurality of adhesive bumps, by removing the reticle after the etching is completed,
wherein disposing the reticle on the elastic adhesive layer comprises:
(i) providing a reticle-manufacturing base plate and a reticle layer formed on the reticle-manufacturing base plate; patterning the reticle layer to form the reticle; binding the elastic adhesive layer and the reticle; and removing the reticle-manufacturing base plate; or
(ii) disposing a reticle layer on the elastic adhesive layer; and patterning the reticle layer to form the reticle.