US 12,412,769 B2
Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability
Yogananda Sarode, Bangalore (IN); Anand Kumar, Bengaluru (IN); and Prashant V. Javali, Bangalore (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 16, 2023, as Appl. No. 18/198,003.
Prior Publication US 2024/0387224 A1, Nov. 21, 2024
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67109 (2013.01); H01L 21/68785 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a hybrid puck corresponding to an electrostatic chuck, the hybrid puck comprising:
a backing region;
a chucking region disposed on the backing region, wherein the backing region comprises a first dielectric material to improve thermal performance of the hybrid puck, and wherein the chucking region comprises a second dielectric material different from the first dielectric material to improve leakage current stability; and
a bond protection structure comprising an elastomer disposed between the backing region and the chucking region.