| CPC H01G 4/228 (2013.01) [H01G 4/224 (2013.01)] | 14 Claims |

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1. An electronic device, comprising:
a ceramic element including a first electrode portion and a second electrode portion;
a first metal terminal including a first electrode connection portion and a first external connection portion, the first electrode connection portion being connected to the first electrode portion through solder; and
a second metal terminal including a second electrode connection portion and a second external connection portion, the second electrode connection portion being connected to the second electrode portion through solder, wherein
the first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion,
the second electrode connection portion includes a second solder stopper formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion to control a range of an adhesion region of solder to the second electrode portion,
at least one of the first solder stopper and the second solder stopper includes an electrode proximity portion on the facing surface and a solder storage portion for storing solder,
the solder storage portion includes a recessed portion extending in a direction away from the ceramic element, and an edge of the recessed portion is closed by the electrode proximity portion.
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