US 12,412,061 B2
Electronic component management method, and housing body for electronic components
Kiyoyuki Nakagawa, Nagaokakyo (JP); Yasuhiro Shimizu, Nagaokakyo (JP); Nobuto Yamada, Nagaokakyo (JP); and Naoto Ikeda, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jun. 6, 2023, as Appl. No. 18/206,129.
Application 18/206,129 is a continuation of application No. PCT/JP2021/038085, filed on Oct. 14, 2021.
Claims priority of application No. 2020-205229 (JP), filed on Dec. 10, 2020.
Prior Publication US 2024/0086673 A1, Mar. 14, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G06K 19/07 (2006.01); G05B 19/418 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/0723 (2013.01) [G05B 19/4183 (2013.01); G06K 19/07773 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic component management method comprising:
manufacturer-side steps performed at a manufacture side facility that manufactures electronic components, the steps including:
housing a plurality of electronic components in a housing body that includes an RFID tag;
writing at least one piece of manufacturer-side information related to the plurality of electronic components housed in the housing body in the RFID tag; and
shipping the housing body in which the manufacturer-side information is written in the RFID tag and the plurality of electronic components are housed; and
user-side steps performed at a user-side facility that uses the plurality of electronic components, the steps including:
receiving the shipped housing body;
reading the manufacturer-side information written in the RFID tag;
providing an electronic circuit board; and
placing each of the plurality of electronic components on the electronic circuit board based on the read manufacturer-side information; wherein
the housing body is a bulk case in which the plurality of electronic components are housed in a loose state;
the RFID tag includes an elongated adhesive seal provided on the RFID tag; and
the RFID tag is attached inside of the bulk case.