| CPC G06F 3/04886 (2013.01) [G06F 3/0482 (2013.01); H01L 21/67092 (2013.01)] | 8 Claims |
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1. A semiconductor wafer dicing apparatus comprising:
a control unit including a computer, and
a touch panel that displays an image in which a plurality of functional buttons is arranged, and
a cutting unit having a cutting blade for cutting a semiconductor wafer,
wherein at least one functional button of the plurality of functional buttons is associated with processing of a workpiece in the semiconductor wafer dicing apparatus, wherein the workpiece is the semiconductor wafer,
wherein the plurality of functional buttons includes a long-touch button which renders a function active after the button is continuously touched for a predetermined time period, and attendant on the long-touch button, a count-down signal notifying a time period remaining before a timing at which the function can be rendered active is displayed, and
wherein attendant on the long-touch button executes the function comprising a procedure for replacing the cutting blade of the semiconductor wafer dicing apparatus,
wherein the function is rendered active in a case in which the timing has come and a finger is moved away from the long-touch button,
wherein the function is not rendered active in a case in which the finger is moved away from the long-touch button before the timing comes,
wherein the function is not rendered active in a case in which the timing has come, the finger is slid from the long-touch button without being moved away from the touch panel, and the finger is moved away from the touch panel at a position spaced from the long-touch button, and
wherein a length of the time period remaining before the timing comes changes every time the long-touch button is touched.
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