US 12,411,547 B2
Pressure sensor device, method for manufacturing the same, and work management system using the same
Ryohei Matsui, Tokyo (JP); Ryotaro Kawahara, Tokyo (JP); Tetsufumi Kawamura, Tokyo (JP); Nobuyuki Sugii, Tokyo (JP); Naoko Ushio, Tokyo (JP); and Hiroyuki Yoshimoto, Tokyo (JP)
Assigned to HITACHI, LTD., Tokyo (JP)
Filed by HITACHI, LTD., Tokyo (JP)
Filed on Apr. 6, 2022, as Appl. No. 17/714,309.
Claims priority of application No. 2021-072739 (JP), filed on Apr. 22, 2021.
Prior Publication US 2022/0342480 A1, Oct. 27, 2022
Int. Cl. G06F 3/01 (2006.01); G01L 1/20 (2006.01); G01L 1/22 (2006.01)
CPC G06F 3/014 (2013.01) [G01L 1/205 (2013.01); G01L 1/225 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A pressure sensor device mounted on a target for detecting pressure, the pressure sensor device comprising:
a flexible substrate base material having flexibility;
an electrode having an exposed metal surface and formed in a predetermined area on the flexible substrate base material; and
a pressure sensor including a pressure-sensitive material that is provided on the electrode and configured to vary in a resistance value thereof depending on an amount of a load,
wherein the pressure sensor including the pressure-sensitive material is configured to be curved and then laminated so as to have a curvature in a static state, and
wherein a radius of a curvature of the pressure sensor device in the static state is smaller than a radius of a curvature of a curved surface of the target, the curvature of the pressure sensor device increasing the resistance value of the pressure-sensitive material for at least one of: reducing a curvature bias load on the pressure sensor, increasing a sensitivity of the pressure sensor, or reducing a degree of false detection.