US 12,411,474 B2
Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control method
Chih-Fu Tsai, Hsinchu (TW); Yu-Chia Chang, Hsinchu (TW); Bo-Jiun Yang, Hsinchu (TW); Yen-Hwei Hsieh, Hsinchu (TW); Shun-Yao Yang, Hsinchu (TW); Jia-Wei Fang, Hsinchu (TW); Ta-Chang Liao, Hsinchu (TW); and Tai-Yu Chen, Hsinchu (TW)
Assigned to MEDIATEK INC., Hsinchu (TW)
Filed by MEDIATEK INC., Hsin-Chu (TW)
Filed on Nov. 23, 2022, as Appl. No. 17/993,853.
Claims priority of provisional application 63/288,682, filed on Dec. 13, 2021.
Prior Publication US 2023/0185280 A1, Jun. 15, 2023
Int. Cl. G05B 19/4155 (2006.01)
CPC G05B 19/4155 (2013.01) [G05B 2219/50333 (2013.01)] 26 Claims
OG exemplary drawing
 
1. An integrated circuit (IC), configurable to perform adaptive thermal ceiling control in a per-functional-block manner, the IC comprising:
a plurality of hardware circuits, arranged to perform operations of a first functional block, wherein at least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block; and
at least one thermal control circuit, coupled to the first functional block, arranged to perform thermal control on the first functional block to prevent the first functional block from overheating and inducing abnormal function operations, by monitoring the at least one temperature sensing result of the first functional block and by trying to prevent the at least one temperature sensing result from exceeding a first temperature upper-limit of the first functional block of the IC, wherein the first temperature upper-limit is configurable with respect to at least one per-functional-block thermal operation capability of the first functional block;
wherein a maximum value of a predetermined temperature region within which the first temperature upper-limit is configured is less than a second temperature upper-limit of the first functional block of the IC; the second temperature upper-limit is determined according to a first per-functional-block thermal-sensor-related feature, to make a temperature region between the second temperature upper-limit and a third temperature upper-limit of the first functional block of the IC correspond to the first per-functional-block thermal-sensor-related feature, wherein the third temperature upper-limit is greater than the second temperature upper-limit, and represents a temperature upper-limit without considering the first per-functional-block thermal-sensor-related feature; and
wherein the third temperature upper-limit is determined according to a second per-functional-block thermal-sensor-related feature, to make a temperature region between the third temperature upper-limit and a fourth temperature upper-limit of the first functional block of the IC correspond to the second per-functional-block thermal-sensor-related feature, wherein the fourth temperature upper-limit is greater than the third temperature upper-limit, and represents a temperature upper-limit without considering the second per-functional-block thermal-sensor-related feature.