US 12,411,427 B2
Shutter apparatus and substrate treating apparatus including the same
Wan Ho Do, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Sep. 7, 2021, as Appl. No. 17/467,949.
Claims priority of application No. 10-2020-0115861 (KR), filed on Sep. 10, 2020.
Prior Publication US 2022/0075281 A1, Mar. 10, 2022
Int. Cl. G03F 7/00 (2006.01); F15B 15/20 (2006.01); F27B 17/00 (2006.01); F27B 17/02 (2006.01); F27D 1/18 (2006.01); G03F 7/16 (2006.01)
CPC G03F 7/70991 (2013.01) [F15B 15/20 (2013.01); F27B 17/0025 (2013.01); F27B 17/02 (2013.01); F27D 1/1858 (2013.01); G03F 7/168 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a process chamber having an opening;
a shutter configured to open and close the opening through a rotation thereof while maintaining a gap with respect to the process chamber while closed; and
a shutter driver having a cylinder configured to open and close the shutter,
wherein the shutter driver includes:
a controller configured to control a pneumatic pressure provided to the cylinder such that, when the shutter is rotated from an opening location to a closing location, a rotational speed of the shutter in a first rotation section including the opening location and a rotational speed of the shutter in a second rotation section including the closing location are different,
wherein the shutter driver includes:
the cylinder;
a first pneumatic pressure line configured to provide a positive pressure for closing the shutter to the cylinder;
a second pneumatic pressure line configured to provide a back pressure for opening the shutter to the cylinder;
a first valve provided in the first pneumatic pressure line;
a second valve provided in the second pneumatic pressure line; and
the controller configured to control the first valve and the second valve,
wherein the controller controls the second valve to provide the back pressure to the cylinder through the second pneumatic pressure line when the shutter enters the second rotation section,
the gap is 3 mm, and
the process chamber has an exhaust hole on a sidewall of the process chamber opposite to the opening, the exhaust hole configured to exhaust air introduced to the process chamber through the gap.