US 12,411,426 B2
Substrate holding board, manufacturing method of device, and exposure device
Shinji Fukui, Tochigi (JP); Toshinao Tatsuno, Tochigi (JP); Hideo Akiba, Tochigi (JP); and Keiji Hirabayashi, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Oct. 26, 2022, as Appl. No. 18/049,945.
Claims priority of application No. 2021-175764 (JP), filed on Oct. 27, 2021; and application No. 2022-101149 (JP), filed on Jun. 23, 2022.
Prior Publication US 2023/0125632 A1, Apr. 27, 2023
Int. Cl. G03F 7/00 (2006.01); B32B 9/00 (2006.01); B32B 38/08 (2006.01)
CPC G03F 7/70958 (2013.01) [B32B 9/007 (2013.01); B32B 38/08 (2013.01); G03F 7/70316 (2013.01); B32B 2307/40 (2013.01); B32B 2551/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate holding board comprising:
a base portion;
a first layer forming an interfacial surface with the base portion or with a protruding portion on the base portion; and
a second layer forming an interfacial surface with the first layer,
wherein the first layer and the second layer contain diamond-like carbon,
wherein a refractive index of the first layer in a wavelength is higher than a refractive index of the second layer in the wavelength, and
wherein the second layer is formed on the first layer,
wherein a hydrogen content of the first layer is smaller than a hydrogen content of the second layer.